Role of soldering parameters on the electrical performances presented by Cu-Sn-Cu joints used in power diodes

R. Martins, Jorge Ricardo da Costa Ferreira, C. Gonçalves, P. Nunes, E. Fortunato, A. P. Marvão, J. I. Martins

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The effects of Sn thickness electrodeposited over Cu on the structural and morphological performance of the joints formed were investigated. The electrical stability of the joints formed was analyzed under extreme aggressive conditions. Results indicated that the proposed soldering technology greatly satisfied the demands concerning soldering specifications.

Original languageEnglish
Pages (from-to)275-279
Number of pages5
JournalMaterials Science And Engineering A-Structural Materials Properties Microst
Volume288
Issue number2
DOIs
Publication statusPublished - Sep 1999

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